Substrate processing method and substrate processing apparatus

Abstract

This disclosure provides a substrate processing method and apparatus that can homogenize the boundary between surface-treated and untreated areas even when the surface treatment time is extended. The substrate processing method involves spraying a processing liquid onto the periphery of a rotating substrate, and determining the offset amount by which the actual liquid-attached position of the processing liquid deviates from a predetermined liquid-attached position due to heating of the substrate, thereby making the actual liquid-attached position the predetermined liquid-attached position, and controlling the processing liquid spray nozzle according to the offset amount.

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