Copper powder and its manufacturing method
TW202635422APending Publication Date: 2026-09-01MITSUI METAL CO LTD
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Patent Information
- Application Number
- TW114147653
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-06
- Filing Date
- 2025-12-05
- Publication Date
- 2026-09-01
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Figure TWG2TA001074812_001 
Figure TWG2TA001074812_002
Abstract
The copper powder of the present invention comprises an aggregate of copper particles containing phosphorus (P). In the X-ray photoelectron spectroscopy obtained by measuring the surface of the copper particles using an X-ray photoelectron spectroscopy apparatus, the ratio of the peak intensity P1 of Cu(I) to the peak intensity PP of P, i.e., P1 / PP, is 15.5 to 250.0 or less. Preferably, phosphorus is distributed throughout the center to the surface of the copper particles. The copper particles are suitably manufactured by a method comprising the following steps: mixing a raw material powder containing an aggregate of copper particles containing phosphorus (P) with an aqueous solution containing a complexing agent containing Cu(II) ions.
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