Copper powder and its manufacturing method

TW202635422APending Publication Date: 2026-09-01MITSUI METAL CO LTD
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Patent Information

Application Number
TW114147653
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-06
Filing Date
2025-12-05
Publication Date
2026-09-01

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Abstract

The copper powder of the present invention comprises an aggregate of copper particles containing phosphorus (P). In the X-ray photoelectron spectroscopy obtained by measuring the surface of the copper particles using an X-ray photoelectron spectroscopy apparatus, the ratio of the peak intensity P1 of Cu(I) to the peak intensity PP of P, i.e., P1 / PP, is 15.5 to 250.0 or less. Preferably, phosphorus is distributed throughout the center to the surface of the copper particles. The copper particles are suitably manufactured by a method comprising the following steps: mixing a raw material powder containing an aggregate of copper particles containing phosphorus (P) with an aqueous solution containing a complexing agent containing Cu(II) ions.
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