Interstitial particles for solder paste, solder paste and bonding structures

Abstract

This invention provides interstitial particles for solder paste, which improve gap control in the obtained connection structure when exposed to high-temperature environments, suppress voids in the connection, and improve conductivity reliability after thermal cycling. The interstitial particles for solder paste of this invention are used as interstitial particles in solder paste. These interstitial particles are resin particles or metal-coated particles. The metal-coated particles have a resin particle body and a metal portion disposed on the surface of the resin particle body. The particle size of the interstitial particles is 30 μm to 200 μm, and in a compression test, the compression deformation rate of the interstitial particles under a load of 300 mN is 55% or less, and the compression recovery rate of the interstitial particles under an unloaded load of 150 mN is 20% or less.

Images