Method for manufacturing substrates with micropores

TW202635433APending Publication Date: 2026-09-01MORU
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Patent Information

Application Number
TW114151053
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-20
Filing Date
2025-12-24
Publication Date
2026-09-01

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Abstract

The method for manufacturing a substrate with micropores provided by the present invention is based on TGV forming technology, which includes: performing perforation on the substrate using time-wavelength modulated laser pulses, and performing chemical etching when the diameter of the through hole formed by the above perforation is 1 μm or more.
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