Manufacturing method of via holes

TW202635434APending Publication Date: 2026-09-01ABSOLICS INC
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Patent Information

Application Number
TW114151211
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-31
Filing Date
2025-12-24
Publication Date
2026-09-01

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Abstract

An embodiment provides a method of manufacturing via holes, comprising: a first processing operation of applying a long-wavelength laser to a predetermined position of a workpiece to form a first hole; and a second processing operation of applying a short-wavelength laser to the position where the first hole has been formed to form a second hole and thereby form a via hole. The workpiece comprises an insulating layer disposed over a core substrate, and the via hole is formed in the insulating layer.
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