Grinding apparatus and grinding method

Abstract

This invention allows for the appropriate removal of polishing fluid or polishing debris during water polishing following polishing with polishing fluid. The provided polishing apparatus includes a water supply mechanism that supplies water to a supply position located in the central area of ​​the polishing surface of the polishing pad. After the polishing apparatus performs a first polishing operation by supplying polishing fluid from the polishing fluid supply mechanism and pressing the workpiece against the polishing pad, the polishing fluid supply is stopped, and water is supplied from the water supply mechanism to the aforementioned supply position at a flow rate of 5 L / min to 15 L / min, and a second polishing operation is performed by pressing the workpiece against the polishing pad.

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