Method of detecting wafer loss in chemical mechanical polisher

TW202635443APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114140845
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-20
Filing Date
2025-10-22
Publication Date
2026-09-01

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Abstract

A substrate polishing apparatus includes a substrate carrier for urging a substrate against a polishing pad. The substrate carrier has a carrier head, a retaining ring, and a flexible membrane in contact with the substrate. A drive system is used to drive the substrate carrier. The apparatus also includes a displacement sensor coupled to the drive system for measuring a distance to the carrier head.
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