Polishing carrier head with electromagnetic pressure control

TW202635446APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114139038
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-12
Filing Date
2025-10-09
Publication Date
2026-09-01

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    Figure TWG2TA001074352_003
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Abstract

A carrier head for positioning a substrate on a polishing surface includes a housing, a support comprising multiple channels therethrough, and a plurality of pressure control elements secured within the multiple channels of the support. Each pressure control element includes an electromagnetic actuator, a first flexible membrane secured to the support such that portions of the first flexible membrane extending from each channel to define a balloon at each channel with each balloon defining a chamber such that actuation of the electromagnetic actuator adjusts a gas pressure in the respective chamber, and a pressure sensor arranged within the chamber.
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