Holding device

Abstract

This invention provides a holding device that maintains the posture of a semiconductor wafer held non-contactly on a holding surface and suppresses contact with the holding surface. Specifically, the holding device 1 includes a clamp 10 that holds the semiconductor wafer β non-contactly via a holding surface 11; and in the holding surface 11, viewed in a direction perpendicular to the holding surface 11, there is a holding region 12 overlapping with the semiconductor wafer β, in which the semiconductor wafer β is held. The clamp 10 has: an attraction part 15 disposed within the holding region 12 to attract gas; and a holding region ejection part 13 disposed within the holding region 12 to eject gas. A holding region outer ejection part 14 for ejecting gas is further provided outside the holding region 12.

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