Band saw cutting machine

TW202635467APending Publication Date: 2026-09-01NACHI FUJIKOSHI CORP
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Patent Information

Application Number
TW114145027
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-17
Filing Date
2025-11-19
Publication Date
2026-09-01

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Abstract

(Project) Provide: A band saw cutting machine that can automatically adjust the tension of the band saw to improve the cutting accuracy of silicon ingots. (Solution) The band saw cutting machine 100 includes: pulley shafts 122 and 124 on the drive side and driven side; a moving mechanism 113 that moves pulleys 126 and 128 mounted on the pulley shafts in the cutting direction; a band saw 104 that is tensioned between the pulleys to cut silicon ingots 102; a cylinder 132 that actuates the pulley shaft on the driven side to apply tension to the band saw; servo motors 144 and 146 that adjust the tilt angle of the pulley shafts; sensors 134 and 136 that are close to and fixed to the pulleys to measure the distance to the surface of the band saw tensioned on the pulleys; and a control unit 148 that continuously measures the distance to the surface of the band saw using the sensors when the band saw moves, calculates the tilt angle of the band saw, drives the servo motors according to the tilt angle, and adjusts the tilt angle of the pulley shafts.
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