Sealing mold and resin sealing device

Abstract

This invention provides a sealing mold and resin sealing device capable of higher precision bottom filling in molding. A sealing mold 202 is used to seal a workpiece W on a substrate Wa, on which electronic components Wb are mounted, to form a molded product Wp using a sealing resin R. The sealing mold 202 includes: a mold cavity 208, which serves as the sealing area for the sealing resin R; a gate 248 for supplying the sealing resin R to the mold cavity 208; a workpiece holding portion 205 for holding the workpiece W; and a retracting member 220, configured to advance towards the workpiece holding portion 205 into the mold cavity 208, and to retract from the mold cavity 208 under the filling pressure of the sealing resin R. The portion of the retracting member 220 on the gate 248 side has a first movable member 222, which is configured to, during mold closing, throttle the flow of the sealing resin R flowing from the gate 248 away from the surface of the workpiece W held by the workpiece holding portion 205.

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