Method of forming articles comprising temporary bonding of substrates

Abstract

A method of forming an article includes: disposing a single bonding layer on a first substrate; disposing a second substrate on the single bonding layer; and heat-treating the single bonding layer at a processing temperature greater than 80°C and less than or equal to 400°C for a processing period of greater than 1 minute and less than or equal to 120 minutes to bond the second substrate to the first substrate, thereby providing a bonding energy of greater than or equal to 500 mJ / m² between the second substrate and the first substrate. The single bonding layer has an average thickness of less than or equal to 10 µm. A method of forming an article includes disposing a unitary bonding layer on a first substrate, disposing a second substrate on the unitary bonding layer, and treating the unitary bonding layer with heat at a treatment temperature greater than 80 ℃ and less than or equal to 400 ℃ for a treatment period greater than 1 minute and less than or equal to 120 minutes to bond the second substrate to the first substrate, thereby providing a bonding energy of the second substrate to the first substrate greater than or equal to 500 mJ / m2. The unitary bonding layer includes an average thickness less than or equal to 10 µm.

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