Micro-electro-mechanical system package and fabrication method thereof

Abstract

A MEMS package includes a first substrate, an interconnect layer, a getter structure, a MEMS device layer and a second substrate. The interconnect layer is disposed on the first substrate. The getter structure is disposed in both the interconnect layer and the first substrate. The getter structure includes multiple trenches and a getter layer. These trenches pass through the interconnect layer and extend downwards into the first substrate. The getter layer is conformally disposed in these trenches and on the interconnect layer. The MEMS device layer is bonded to the interconnect layer. The second substrate includes a cavity and is bonded to the MEMS device layer.

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