MEMS device having reduced package size

Abstract

A microelectromechanical systems (MEMS) device and methods for its fabrication are disclosed. The MEMS device includes a processing layer having processing circuitry and a plurality of bond pads and a MEMS layer bonded to the processing layer. Signals generated by a MEMS component are processed by the circuitry and routed through a plurality of electrical connections extending vertically from the bond pads to a redistribution layer and a plurality of solderable pads that define external contact points for direct electrical bonding to external circuitry. The MEMS and processing layers, along with the electrical connections, are encapsulated in an overmold with the solderable pads exposed at a substantially planar package surface.

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