Method for depositing metal conductive layer on glass substrate

Abstract

This disclosure is a method for depositing a metal conductive layer on a glass substrate, comprising the following steps: cleaning a glass substrate and forming a titanium metal film on a surface of the glass substrate. The titanium metal film is surface-treated by a reactive plasma to form an intermediate layer, wherein the reactive plasma includes an oxygen plasma, a nitrogen plasma, a fluorine plasma, or a chlorine plasma, and the intermediate layer includes a titanium oxide film, a titanium nitride film, a titanium fluoride film, or a titanium chloride film. A titanium metal conductive layer is formed on the intermediate layer of the glass substrate. The titanium metal conductive layer is connected to the glass substrate through the intermediate layer, which can increase the adhesion between the titanium metal conductive layer and the glass substrate, and is beneficial to improve the yield and reliability of subsequent packaging processes.

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