Alumina ceramic tungsten metallization paste, its preparation method and application

TW202635614APending Publication Date: 2026-09-01JUNYUAN ELECTRONIC TECHNOLOGY (HAINING) CO LTD
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Patent Information

Application Number
TW114134522
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-18
Filing Date
2025-09-09
Publication Date
2026-09-01
Patent Text Reader

Abstract

This invention discloses a tungsten metallization paste for alumina ceramics, its preparation method, and its application, belonging to the technical field of tungsten metallization pastes. The tungsten metallization paste is used for co-firing with alumina ceramics containing 92%–96% alumina. The tungsten metallization paste comprises, by mass ratio: 65%–87% conductive tungsten powder, 3%–15% inorganic binder phase, and 10%–30% organic carrier. The total mass ratio of the conductive tungsten powder, the inorganic binder phase, and the organic carrier is 100%. The inorganic binder phase comprises 92%–96% Al₂O₃ powder and 0.5%–7.5% sintering aids, including rare earth oxides and alkali metal oxides. The organic carrier comprises 8%–38% organic binder, 10%–50% plasticizer, and 3%–75% solvent. The tungsten metallization paste of this invention has advantages such as good fluidity, good thixotropy, high resolution, and low sheet resistance, with a sheet resistance value in the range of 9–28 mΩ / □.
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