Hollow resin particles, resin compositions for semiconductor components, and dispersions
TW202635745APending Publication Date: 2026-09-01SEKISUI PLASTICS CO LTD
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Patent Information
- Application Number
- TW114150278
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-26
- Filing Date
- 2025-12-19
- Publication Date
- 2026-09-01
Abstract
Hollow resin particles according to an embodiment of the present invention are hollow resin particles having a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion contains a polymer (P1) obtained by reaction of a monomer component (M), the hollow resin particles having an average particle diameter of
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