Methods for forming photosensitive elements and resist patterns and manufacturing printed wiring boards
TW202635746APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information
- Application Number
- TW114139085
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-17
- Filing Date
- 2025-10-09
- Publication Date
- 2026-09-01
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Figure TWG2TA001074353_001 
Figure TWG2TA001074353_002
Abstract
The disclosed photosensitive element includes a support and a photosensitive layer formed on the support. The photosensitive layer contains an adhesive polymer, a photopolymerizable compound, a photopolymerization initiator, a sensitizer, and an ultraviolet absorber. Each photosensitive layer with a thickness of 1 μm has an absorbance of 0.025 or more for light with a wavelength of 365 nm and an absorbance of 0.010 or more for light with a wavelength of 405 nm.
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