Resin compositions and prepregs using the same, resin-coated films, resin-coated metal foils, metal-clad laminates, and wiring boards

TW202635756APending Publication Date: 2026-09-01PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
TW115119494
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-05-17
Filing Date
2022-05-16
Publication Date
2026-09-01

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Abstract

One aspect of the present invention relates to a resin composition comprising: a hydrocarbon compound (A) of formula (1) below, [in formula (1), X represents a hydrocarbon group having 6 or more carbon atoms, which includes at least one selected from aromatic cyclic groups and aliphatic cyclic groups. n represents an integer from 1 to 10.]; and a styrene polymer (B) different from the aforementioned hydrocarbon compound (A) and which is solid at 25°C.
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