Thermosetting resin composition and cured film formed using the thermosetting resin composition

TW202635758APending Publication Date: 2026-09-01DONGWOO FINE CHEM CO LTD

View PDF 0 Cites 0 Cited by

Patent Information

Application Number: TW115107174
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-02-27
Filing Date: 2026-02-26
Publication Date: 2026-09-01

Application Information

Patent Timeline

27 Feb 2025

Priority

26 Feb 2026

Application

TW115107174

01 Sep 2026

Publication

TW202635758A

IPC: C08F220/14; C08F220/28; C08J5/18; C08K5/3445; C08K5/42; C08L33/04; H10P52/40

Inventors: 崔慶默; 劉仁浩

Get more patent work done with AI

Run novelty searches—or use them for FTO, design risk, drafting and technical problem-solving.

Explore More Agents

Novelty Search
Search existing technologies and assess novelty
↗
FTO
Analyze whether a product may infringe others' patents
↗
Design FTO
Check prior-design risk for exterior design
↗
Drafting
Draft patent application text based on a technical solution
↗
Find Solutions with TRIZ
Generate feasible solution to solve your technical challenge
↗
IP MCP Servers
Connect trusted patent search and cited evidence to Claude, Cursor or your own AI workflow
↗

Patent Text Reader

Abstract

This invention provides a thermosetting resin composition comprising an adhesive resin, a thermal initiator, a thermosetting agent, and a solvent, wherein the adhesive resin comprises an acrylic copolymer having a specific structure, and a cured film formed using the thermosetting resin composition. The thermosetting resin composition according to the invention is suitable for appropriate grinding speeds in CMP processes and exhibits excellent smoothness.

Need to check novelty before this filing date? Find Prior Art