Resin compositions, curing agents, sealing materials, adhesives, and semiconductor packaging and methods of manufacturing thereof.

Abstract

This invention relates to a resin composition comprising: an epoxy resin, a curing agent, and an inorganic filler, wherein the epoxy resin comprises: (a) a tetrafunctional aromatic epoxy resin, and one or more epoxy resins selected from those having a naphthalene skeleton, a biphenyl skeleton, a naphthalene skeleton, or an anthracene skeleton, and (b) an aliphatic epoxy resin represented by a defined formula, wherein the mass ratio of component (a) to the content of other epoxy resins is 10:90 to 81:19, and the mass ratio of component (b) to the content of other epoxy resins is 0.1:99.9 to 25:75.