Resin components, composite materials and hardened composite materials

TW202635773APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information

Application Number
TW114150793
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-27
Filing Date
2025-12-23
Publication Date
2026-09-01
Patent Text Reader

Abstract

A resin composition comprising an epoxy resin having an epoxy group, wherein the epoxy resin has an acid value of less than 1 KOH mg / g (A), at least one monomer selected from free radical polymerizable monomers and epoxy monomers (B), at least one monomer selected from benzoic acid and benzoic acid derivatives (C), and a tackifying component (D), wherein the content ratio of component (C) to component (D) in the aforementioned resin composition ([at least one monomer selected from benzoic acid and benzoic acid derivatives] / [tackifying component]) is greater than 0.5 and less than 6.0 by mass.
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