Resin composition, cured material, laminate, method for manufacturing cured material, method for manufacturing laminate, method for manufacturing semiconductor device, and semiconductor device.

Abstract

The present invention provides a resin composition, a cured product formed by curing the resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, and a semiconductor device containing the cured product. The resin composition comprises: a polyimide having a reactive functional group at its end that can be protected; and a compound B that reacts with the reactive functional group by at least one of heat, acid, and alkali.