Photosensitive resin composition, method for manufacturing hardened embossed patterns and hardening film

Abstract

This invention relates to photosensitive resin compositions, etc. This invention relates to a photosensitive resin composition comprising (A) polyimide, (B) a solvent, and (C) a photopolymerization initiator. The polyimide (A) has the structure represented by the following general formula (1) and does not have polymerizable functional groups on its side chains. The product of the weight average molecular weight (Mw) of the polyimide (A) and R calculated by the following formula (b) {Mw×R(FCont.)} satisfies the following formula (a): R(FCont.)=(Mwf+1) / (Mwx+MwY-36)···(b) (where Mwf is the total mass of fluorine atoms that can be contained in the polyimide (A), Mwx is the molecular weight of the tetracarboxylic acid dianhydride constituting the polyimide (A), and MwY is the molecular weight of the diamine constituting the polyimide (A)). 300≦Mw×R≦948···(a).

Images