Hardening components

Abstract

The present invention aims to provide a curable composition with excellent processability and permeability to narrow crevices. This curable composition can be formed and possesses properties such as adhesion strength to metals like copper, mechanical properties, electrical properties (low relative permittivity, low dielectric tangent, etc.), and insulation. It is applicable to electronic components such as sealants, extension films, or underfills in semiconductor devices. The solution is as follows: a curable composition comprising: an epoxy resin including bisphenol-type epoxy resin and glycidylamine-type epoxy resin, silicon oxide particles, and an amine-based curing agent; wherein, in the total amount of the aforementioned epoxy resin, the content of the aforementioned bisphenol-type epoxy resin is less than 60% by mass, and the content of the aforementioned glycidylamine-type epoxy resin is greater than 40% by mass; the aforementioned silicon oxide particles include solid silicon oxide particles and hollow silicon oxide particles, and the content of the aforementioned hollow silicon oxide particles in the total amount of the aforementioned silicon oxide particles is greater than 1 volume.