Resin composition and semi-conductor device

Abstract

The objective of this invention is to provide a resin composition that achieves high thermal conductivity, low elastic modulus, and high adhesion to metals in the cured form of the resin composition. The resin composition comprises an epoxy resin (A), a curing agent (B), a polyisoprene compound (C), and an inorganic filler (D). The polyisoprene compound (C) has at least one functional group selected from the group consisting of anhydride groups and carboxyl groups. The inorganic filler (D) comprises a silica filler (D-2) and a thermally conductive filler (D-1) with a higher thermal conductivity than the silica filler (D-2). The content of the thermally conductive filler (D-1) is 60% by mass or more and less than 100% by mass relative to the total content of the silica filler (D-2) and the thermally conductive filler (D-1).

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