Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and printed wiring board

Abstract

The objective of this invention is to provide a resin composition that can suppress the presence of inorganic fillers in a hardened material and that results in a hardened material with high flame retardancy. The resin composition contains an epoxy compound (A), a maleimide compound (B), a hardener (C), a phosphorus-based flame retardant (D), and an inorganic filler (E). The resin composition does not contain hydrated metal compounds. The phosphorus-based flame retardant (D) comprises at least one selected from the group consisting of phosphate ester compounds (D1) and phosphine compounds (D2). The content of the phosphorus-based flame retardant (D) is 3.0 parts by mass or more and 20.0 parts by mass or less relative to the total of 100 parts by mass of the epoxy compound (A), the maleimide compound (B), and the hardener (C). The inorganic filler (E) contains silicon dioxide particles (E1), and the silicon dioxide particles (E1) have an average particle size (D50) of 0.1µm or more and less than 2.5µm in the particle size distribution based on the volume diffraction method.

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