Resin compositions, their cured products, sheet-like laminates, resin sheets, printed wiring boards, and semiconductor devices

Abstract

The objective of this invention is to provide a resin composition that yields a cured product with excellent mechanical strength and plating adhesion. This invention is a resin composition comprising (A) a compound having a carbodiimide structure and containing a free radical polymerizable group, and further comprising (B) a compound not having a carbodiimide structure and containing a free radical polymerizable group, and (C) at least one of the following:

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