Epoxy resin composition

TW202635813APending Publication Date: 2026-09-01NAMICS CORPORATION
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Patent Information

Application Number
TW114146905
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-02
Filing Date
2025-12-01
Publication Date
2026-09-01

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Abstract

This invention provides an epoxy resin composition that exhibits excellent temporary adhesion and suppresses substrate warping during formal curing. The epoxy resin composition comprises: an epoxy resin (A); a curing agent (B); a latent curing catalyst (C); and an inorganic filler (D); wherein the molar ratio of reactive groups in the curing agent (B) to epoxy groups in the epoxy resin (A) is 0.35 to 0.85, the content of the latent curing catalyst (C) relative to the resin component (100% by mass) in the composition is 10 to 16% by mass, and the content of the inorganic filler (D) is 35 to 67% by mass.
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