Resin composition, dry film and cured product

TW202635814APending Publication Date: 2026-09-01TAIYO HOLDINGS CO LTD

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Patent Information

Application Number: TW115106106
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-02-26
Filing Date: 2026-02-13
Publication Date: 2026-09-01

Application Information

Patent Timeline

26 Feb 2025

Priority

13 Feb 2026

Application

TW115106106

01 Sep 2026

Publication

TW202635814A

IPC: C08L63/02; C08G59/18; C08G73/10; C08L63/04; C09D5/23

Inventors: 野口智崇; 仲田和貴

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Abstract

This invention provides a resin composition, a dry film, and a cured product. The resin composition ensures reliable insulation while possessing magnetic properties, and suppresses leakage and warping after curing. The resin composition comprises: a solid epoxy resin with a weight average molecular weight of 20,000 or more and an epoxy equivalent of 2,500 to 9,000; a liquid epoxy resin; a magnetic filler; and an epoxy curing agent.

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