Resin composition, resin film, resin film with support, printed circuit board and semiconductor package

Abstract

A resin composition is provided, as well as a resin film using the aforementioned resin composition, a resin film with a support, a printed circuit board, and a semiconductor package. The resin composition exhibits excellent flexibility in its solid state and demonstrates low dielectric loss tangent (Df) in high-frequency bands (e.g., above 10 GHz). Specifically, the aforementioned resin composition is a resin composition containing: (A) a maleimide resin containing an indane ring; (B) an inorganic filler material; and (X) a compound that is liquid at 25°C and has maleimide groups. none