Curable silicone composition and cured body therefrom

Abstract

[Topic] The purpose of this invention is to provide a curable polysiloxane composition and its uses. The cured product exhibits high hardness and mechanical strength (including tensile strength and elongation) near room temperature, and also exhibits excellent viscoelastic properties such as stress attenuation, vibration absorption, and impact absorption. [Solution] A curable polysiloxane composition, its cured product, and its use in semiconductor devices, the curable polysiloxane composition being characterized in that: within a specific mass percentage range, it contains (A) an organopolysiloxane resin without curing reactive functional groups, (B) a chain-like organopolysiloxane with curing reactive functional groups, (C) an organopolysiloxane having more than 10% by mass of a curing reactive functional group containing carbon-carbon double bonds within the molecule and having the curing reactive functional group at the end of the molecule, and contains (D) a curing agent, and the amount of the curing reactive functional group containing carbon-carbon double bonds in 100g of the composition is 2.0 moles or more, the cured product exhibits a glass transition temperature between -30 and 120°C, and the storage modulus at 25°C is 0.5 MPa or more. none