Chemical mechanical polishing slurry and its use
TW202635834APending Publication Date: 2026-09-01ANJI MICROELECTRONICS TECH (SHANGHAI) CO LTD
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Patent Information
- Application Number
- TW115101360
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-27
- Filing Date
- 2026-01-14
- Publication Date
- 2026-09-01
Abstract
The present invention provides a chemical mechanical polishing (CMP) slurry for polyimide film polishing, comprising: alumina abrasive, surfactant, and water. The CMP slurry of invention has a high removal rate for polyimide films.
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