Manufacturing methods for workpiece processing wafers and semiconductor devices

Abstract

The present invention addresses the problem of providing a workpiece processing wafer with excellent antistatic properties and a method for manufacturing a semiconductor device using the workpiece processing wafer. As a means to solve this problem, a workpiece processing wafer is provided, comprising: a release sheet having a release agent layer on one side of a release substrate; and a workpiece attachment layer deposited on the side of the release agent layer opposite to the release substrate; wherein the surface resistivity of the side of the release agent layer opposite to the release substrate is less than 1.5 × 10¹² Ω / sq.