Adhesive tape for workpiece processing and back-side grinding method of workpiece

TW202635841APending Publication Date: 2026-09-01LINTEC CORP

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Patent Information

Application Number: TW115105973
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-02-21
Filing Date: 2026-02-13
Publication Date: 2026-09-01

Application Information

Patent Timeline

21 Feb 2025

Priority

13 Feb 2026

Application

TW115105973

01 Sep 2026

Publication

TW202635841A

IPC: C09J9/00; G01N3/40; H10P52/00

Inventors: 深田智哉

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Abstract

The technical problem of the present invention is to provide a workpiece processing tape that is essentially a single layer, which can suppress wrinkles and stably attach to the workpiece; the means to solve this technical problem is that, according to the present invention, a workpiece processing tape 10 that is essentially a single layer is provided, wherein the pressing depth D1 of the first side 12 is 3 μm or more, and the pressing depth D2 of the second side 14 is 1.5 μm or less.

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