Curable resin compositions, cured films and laminated films
TW202635848APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information
- Application Number
- TW114146174
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-28
- Filing Date
- 2025-11-26
- Publication Date
- 2026-09-01
Abstract
The curable resin composition disclosed herein contains (A) a rubber component, (B) a crosslinking component with epoxy groups, (C) a maleic diamide compound, and (D) a filler.
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