Slurry, grinding method and manufacturing method of parts
TW202635855APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information
- Application Number
- TW115101640
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-17
- Filing Date
- 2026-01-15
- Publication Date
- 2026-09-01
Abstract
A slurry comprising abrasive grains and water, the abrasive grains comprising cerium oxide particles, wherein in the Raman spectrum of the cerium oxide particles obtained by Raman spectroscopy analysis using a light source at a wavelength of 457 nm, the ratio of the height of the peak belonging to peroxide ions to the height of the peak of the F2g vibrational mode belonging to cerium oxide is 0.05% or more. A grinding method comprising the step of grinding a workpiece using the slurry. A method for manufacturing a part comprising the step of obtaining a part using a workpiece ground by the grinding method.
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