Colloidal silica and its manufacturing method

TW202635856APending Publication Date: 2026-09-01FUSO CHEM
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Patent Information

Application Number
TW115119165
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-07
Filing Date
2026-01-22
Publication Date
2026-09-01
Patent Text Reader

Abstract

This invention provides a colloidal silica that, when used as an abrasive for grinding, does not easily leave silica particles on the grinding surface and can form a grinding surface with reduced surface roughness. The colloidal silica is formed by dispersing silica particles in a solvent, characterized in that the true specific gravity of the silica particles based on a liquid-phase displacement method is 1.60 or more and 2.20 or less, and the value of the composite parameter 1 calculated by a specific formula is 10 or more and 200 or less.
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