Silicon etch with dopant-type selectivity

TW202635861APending Publication Date: 2026-09-01TOKYO OHKA KOGYO CO LTD
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Patent Information

Application Number
TW114148679
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-12-11
Publication Date
2026-09-01

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Abstract

An etchant composition offers an etch rate on silicon which is sensitive to a dopant type of the silicon. The etchant composition comprises a water-soluble etchant, one or more water-miscible organic solvents, and one or more surfactants.
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