Etching gas containing hexafluoro-2-butyne

TW202635862APending Publication Date: 2026-09-01DAIKIN INDUSTRIES LTD
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Patent Information

Application Number
TW115103372
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-25
Filing Date
2026-01-28
Publication Date
2026-09-01
Patent Text Reader

Abstract

The object of this invention is to novelly provide an etching gas containing hexafluoro-2-butyne. That is, an etching gas containing hexafluoro-2-butyne.
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