Copper alloy plastic processing materials and parts for electronic and electrical machinery
TW202635903APending Publication Date: 2026-09-01MITSUBISHI MATERIALS CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114151213
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2025-12-24
- Publication Date
- 2026-09-01
Smart Images
Figure TWG2TA001075036_001 
Figure TWG2TA001075036_002
Abstract
It is characterized by having an Fe content of 0.08% to 0.17% by mass, a P content of 0.025% to 0.06% by mass, a residual component of Cu and unavoidable impurities, a conductivity of 75% IACS or higher, a Vickers hardness of 130 HV or higher at room temperature, a surface heat resistance temperature TS and an internal heat resistance temperature TI of 450°C or higher, and a TI / TS ratio of 0.95 or higher.
Need to check novelty before this filing date? Find Prior Art