Copper alloys and electronic components

TW202635904APending Publication Date: 2026-09-01JX NIPPON MINING & METALS CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114127049
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-16
Filing Date
2025-07-17
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001074231_001
    Figure TWG2TA001074231_001
  • Figure TWG2TA001074231_002
    Figure TWG2TA001074231_002
Patent Text Reader

Abstract

The copper alloy of the present invention contains 1.5% by mass and 4.6% by mass of Ni, 0.10% by mass and 0.80% by mass of Co, 0.10% by mass and 1.3% by mass of Si, 0.010% by mass and 0.10% by mass of Cr, and the remainder consists of Cu and unavoidable impurities. The volume fraction of the copper alloy in the cube orientation is 30.0% or more. none
Need to check novelty before this filing date? Find Prior Art