Metal deposition for voidless gap fill

TW202635923APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114138053
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-19
Filing Date
2025-10-02
Publication Date
2026-09-01

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Abstract

Methods for filling a substrate feature with a seamless fluorine free tungsten gap fill are described. Methods comprise exposing a substrate surface to a tungsten precursor and a reducing agent substantially simultaneously, wherein the dosage of the tungsten precursor is in a range of from greater than
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