Method for forming an electrode layer on a substrate and apparatus for forming an electrode layer on a substrate

TW202635926APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114142758
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-13
Filing Date
2025-11-04
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001074583_001
    Figure TWG2TA001074583_001
  • Figure TWG2TA001074583_002
    Figure TWG2TA001074583_002
  • Figure TWG2TA001074583_003
    Figure TWG2TA001074583_003
Patent Text Reader

Abstract

An electrode layer is formed by depositing a first layer containing titanium and nitrogen and a second layer containing vanadium and nitrogen. A method for forming an electrode layer on a substrate includes the following steps: performing at least one cycle of alternating supply of a titanium-containing raw material gas and a nitriding gas for nitriding titanium to the substrate to form a first layer containing titanium and nitrogen; and performing at least one cycle of alternating supply of a vanadium-containing raw material gas and a nitriding gas for nitriding vanadium to the substrate to form a second layer containing vanadium and nitrogen; and performing at least one combination of the steps of forming the first layer and forming the second layer to form an electrode layer having the first and second layers deposited.
Need to check novelty before this filing date? Find Prior Art