Method for forming an electrode layer on a substrate and apparatus for forming an electrode layer on a substrate
TW202635926APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114142758
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-13
- Filing Date
- 2025-11-04
- Publication Date
- 2026-09-01
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Abstract
An electrode layer is formed by depositing a first layer containing titanium and nitrogen and a second layer containing vanadium and nitrogen. A method for forming an electrode layer on a substrate includes the following steps: performing at least one cycle of alternating supply of a titanium-containing raw material gas and a nitriding gas for nitriding titanium to the substrate to form a first layer containing titanium and nitrogen; and performing at least one cycle of alternating supply of a vanadium-containing raw material gas and a nitriding gas for nitriding vanadium to the substrate to form a second layer containing vanadium and nitrogen; and performing at least one combination of the steps of forming the first layer and forming the second layer to form an electrode layer having the first and second layers deposited.
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