Method of depositing a metal layer at low temperature

TW202635930APending Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW114148833
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-12
Filing Date
2025-12-12
Publication Date
2026-09-01

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Abstract

A method for depositing a metal layer on a substrate includes cooling a pedestal to a temperature below zero and supporting the substrate on the pedestal. The method also includes depositing a metal layer on the substrate and reflowing the metal layer.
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