Ceramic heater assembly with integrated stress relief useful in the fabrication of microelectronic devices

Abstract

A heated workpiece support module useful to support a microelectronic workpiece in a process chamber during a process. The heated workpiece support module has a z-axis and includes a heated platen having a top and a backside and a hollow pedestal. The workpiece is supported over the top of the platen during the process. The hollow pedestal is attached to the backside of the heated platen. The hollow pedestal contains an interior volume. The hollow pedestal is attached to the heated platen by a plurality of bonding interfaces that are configured to create a vacuum tight seal between the heated platen and the pedestal. The plurality of bonding interfaces include a first, continuous bonding zone that surrounds the interior passageway and that attaches the heated platen to the hollow pedestal proximal to the interior passageway; and a second, independent, separate and continuous bonding zone that surrounds the interior volume and that attaches the heated platen to the hollow pedestal distal from the interior passageway, wherein at least a major portion of the second, independent, separate, and continuous bonding zone is separated from the first, continuous bonding zone by a bond-free zone. At least a first interface portion of the first, continuous bonding zone is at a different z-height on the z-axis relative to at least a first interface portion of the second, continuous bonding zone.

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