Copper foil, copper-clad laminates and printed wiring boards

TW202635951APending Publication Date: 2026-09-01JX NIPPON MINING & METALS CORP
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Patent Information

Application Number
TW114143086
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-25
Filing Date
2025-11-05
Publication Date
2026-09-01
Patent Text Reader

Abstract

The present invention relates to a copper foil having a composition comprising 160 to 240 ppm Ag by mass and the remainder consisting of Cu and unavoidable impurities, with a surface S orientation density of 29.0 or higher and a Brass orientation density of 40.0 to 65.0. none
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