Electroplating apparatus, method of de-bubbling electroplating apparatus, and de-bubbler device

TW202635959APending Publication Date: 2026-09-01LAM RES CORP
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Patent Information

Application Number
TW115104551
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-12-01
Filing Date
2021-11-29
Publication Date
2026-09-01

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Abstract

In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate. An example electroplating apparatus comprises a plating cell to receive a plating solution, an electrode, a counter electrode, a substrate holding fixture, a resistive element, and a de-bubbler device supportable rotatably adjacent the resistive element to generate or direct a flow of plating solution through the resistive element to release trapped bubbles.
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