Three-dimensional vapor chamber assembly structure

TW202636058APending Publication Date: 2026-09-01TAIWAN MICROLOOPS CORP
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Patent Information

Application Number
TW114107151
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-26
Publication Date
2026-09-01

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Abstract

A three-dimensional vapor chamber assembly structure includes a housing, a heat pipe, a capillary and a working fluid. The housing includes a first shell plate and a second shell plate. A cavity is formed between the first shell plate and the second shell plate. A hole is arranged in the second shell plate. The heat pipe having an open end. The open end having a flange. The flange includes a transverse plane and a longitudinal plane. Wherein the transverse plane of the flange is bonded to the second shell plate through a welded layer, and the longitudinal plane of the flange is bonded to the second shell plate through a welded element. The capillary is arranged in the cavity and attached to the housing. The working fluid is in the cavity.
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