Method of producing reference spectral library for use in film-thickness estimation for workpiece
TW202636070APending Publication Date: 2026-09-01EBARA CORP
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Patent Information
- Application Number
- TW114150169
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-25
- Filing Date
- 2025-12-19
- Publication Date
- 2026-09-01
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Abstract
[Problem] This invention provides a technique to expand the range of multiple reference spectra used for film thickness estimation on workpieces such as wafers, thereby increasing the range of film thicknesses that can be estimated. [Solution] The method for creating a reference spectrum library involves generating a pre-grinding reference spectrum corresponding to a pre-grinding time tm-1 before the start of grinding on the reference workpiece (tm) and a post-grinding reference spectrum corresponding to a post-grinding time tn+1 after the end of grinding on the reference workpiece (tn) by extrapolation. Multiple reference film thicknesses T-1 to T+1 corresponding to the pre-grinding reference spectrum, multiple actual reference spectra, and post-grinding reference spectra are calculated. A reference spectrum library is created by associating the multiple reference film thicknesses T-1 to T+1 with the pre-grinding reference spectrum, multiple actual reference spectra, and post-grinding reference spectrum, respectively.
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